| 摘要 |
<p>PURPOSE: To prevent peeling of an external lead terminal from a metallized wiring layer together with a brazing material by connecting the layer of an insulating base to the terminal via gold-tin-lead-silver alloy or gold-tin-lead- palladium alloy. CONSTITUTION: The metallized wiring layer 4 of an insulating base 1 is covered with a gold plating metal layer 8, and an external lead terminal 2 is sequentially covered with a silver or palladium plated metal layer 9 and a tin-lead alloy plated metal layer 10. Then, the inner end of the terminal 2 is placed on the layer 4 of the base 1, heated, gold-tin-lead-silver alloy or gold-tin-lead-palladium allow is formed between the layer 4 and the terminal 2, cooled to be solidified, and the terminal 2 is connected to the layer 4 of the base 2 via the brazing material 6 of gold-tin-lead-silver alloy or gold-tin-lead palladium alloy. Thus, an inner semiconductor element is electrically accurately and effectively connected to an external electric circuit.</p> |
