| 摘要 |
PURPOSE: To realize multipin and low heat resistance package of a low cost by performing primary connection for an LSI chip with an insulation film wherein a wiring pattern is formed on a surface and by performing secondary connection for a terminal on the insulation film and a substrate with a gold wire. CONSTITUTION: The rear of an LSI chip 1 with the face down is bonded to a tab lead 2 and a hanging lead 3 is extended from an end part of the tab lead 2 toward below the outside and is adhered to an end part of an upper surface of a lamination wiring board 4. An electrode terminal of the chip 1 is extracted by a beam lead 5 and a tip thereof is primarily connected with an insulation film 6. A wiring part of the insulation film 6 and a terminal 7 of an upper surface of the substrate 4 are secondarily connected with a gold line 8. Thereby, multipin face-down BGA package of a low cost which is excellent in heat dissipation can be realized. |
