| 摘要 |
PURPOSE: To prepare a modified polyimide film having high tensile modulus, excellent chemical resistance, large bonding strength, and high dimensional accuracy by specifying particular properties and the content of a particular element. CONSTITUTION: This arom. polyimide film comprises an arom. tetracarboxylic acid component and an arom. diamine component. It has an average coefficient of linear expansion of not more than 2.5×10<-5> deg.C<-1> in the temp. of from about 50 to 300 deg.C, a thermal dimensional change of not more than 0.3% in terms of a dimensional change between the dimension of the film as measured at room temp. and the dimension of the film as measured after raising the temperature of the film to 400 deg.C and heating the film at that temperature for 2hr, a C to O ratio on at least one surface of the film of 2.9 to 4.6 (wt. ratio), an O to N ratio of 2.4 to 3.5, an Si content in the surface of the film of 0.7 to 3.0%, and a content of P in the whole film of 5 to 500ppm. Pref., the film is formed by applying a silane coupling agent soln. on the surface of a film, prepd. by casting a polyamic acid soln. contg. a phosphorus-contg. compd., and heating the coating. |
