发明名称 |
Apparatus for burn-in of high power semiconductor devices |
摘要 |
A thermal control system for use with a burn-in system, the thermal control system capable of delivering a thermally preconditioned liquid to a plurality of semiconductor devices during burn-in. The thermal control system comprises a liquid reservoir containing a liquid, a pump, and a plurality of spray nozzle arrays. The liquid contained in the liquid reservoir is thermally preconditioned through the use of a heating element and a cooling element and the temperature of the liquid provided to each spray nozzle array is individually controlled through the use of a pipe heating element. The liquid is collected and returned to the liquid reservoir after being sprayed on the semiconductor devices.
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申请公布号 |
US5515910(A) |
申请公布日期 |
1996.05.14 |
申请号 |
US19930056675 |
申请日期 |
1993.05.03 |
申请人 |
MICRO CONTROL SYSTEM |
发明人 |
HAMILTON, HAROLD E.;BLOCH, BRIAN R.;ZIMMER, JAMES R. |
分类号 |
G01R31/28;G01R31/30;(IPC1-7):F25B29/00 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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