发明名称 Process for making through-hole connections in multilayer printed circuit boards
摘要 The through-bore contact system has the circuit board (2) supported by a frame (3) so that the circuit board bores are free on either side, with a needle used to dispense a contact paste plug into each bore. The needle is then removed and replaced by a suction pin of the dispenser, for removing the excess contact paste, while leaving the sides of the bore coated with the contact paste. The dispenser needle and the suction pin may be combined with a drilling head, allowing the through-bore contacts to be provided simultaneous with the machining of the circuit board for providing the bores.
申请公布号 EP0711106(A1) 申请公布日期 1996.05.08
申请号 EP19950117233 申请日期 1995.11.02
申请人 LPKF CAD/CAM SYSTEME GMBH 发明人 WENKE, STEPHAN
分类号 H05K3/40;H05K3/46 主分类号 H05K3/40
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