摘要 |
<p>PURPOSE: To obtain a polymerizable imide compound useful as a synthetic raw material for a heat-resistant synthetic resin, an adhesive, a coating compound, having excellent heat resistance and such a radical polymerizability as to be bondable and curable at a relatively low temperature. CONSTITUTION: A compound of formula I (X1 and X2 are each a radically polymerizable terminal unsaturated group-containing organic residue and is CH2 =CH-ϕor CH2 =C(R1 ); Y1 and Y2 are each CH2 , CO or SO2 ; Z is a 2-20C alkylene or a 6-10C arylene;ϕis benzene ring; R1 is H or methyl; aromatic ring may be substituted with H, an alkyl, nitro or amino). A phthalimide compound of formula II (R2 to R5 are each H, a 1-4C alkyl, nitro or amino) is reacted with an organic acid halide or an organic halide of the formula X1 Y1 - halogen or X2 Y2 -halogen to give a phthalimide compound. Then the nitro group of the compound is reduced to amino group and the resultant substance is reacted with an organic acid halide to give the compound of formula I. The compound of formula I is polymerized or copolymerized with another monomer to readily form a resin.</p> |