发明名称 |
Composite plating method |
摘要 |
<p>A composite plating film is prepared from a composite plating solution containing a metal matrix and insoluble particles 4 dispersed therein or deposited therewith. The composite plating film has a non-uniform concentration of insoluble particles along a direction of the thickness of the composite film. The non-uniform concentration is an achieved by changing the discharge rate of composite plating solution during deposition of the film on the base material. <IMAGE></p> |
申请公布号 |
EP0709493(A2) |
申请公布日期 |
1996.05.01 |
申请号 |
EP19950115800 |
申请日期 |
1995.10.06 |
申请人 |
TOYODA GOSEI CO., LTD. |
发明人 |
TAKEUCHI, HIROMITSU;TSUNEKAWA, YOSHIKI;OKUMIYA, MASAHIRO |
分类号 |
C23C18/52;C23C24/04;C25D5/08;C25D5/44;C25D15/02;(IPC1-7):C25D5/00;C25D21/12 |
主分类号 |
C23C18/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|