发明名称 Composite plating method
摘要 <p>A composite plating film is prepared from a composite plating solution containing a metal matrix and insoluble particles 4 dispersed therein or deposited therewith. The composite plating film has a non-uniform concentration of insoluble particles along a direction of the thickness of the composite film. The non-uniform concentration is an achieved by changing the discharge rate of composite plating solution during deposition of the film on the base material. &lt;IMAGE&gt;</p>
申请公布号 EP0709493(A2) 申请公布日期 1996.05.01
申请号 EP19950115800 申请日期 1995.10.06
申请人 TOYODA GOSEI CO., LTD. 发明人 TAKEUCHI, HIROMITSU;TSUNEKAWA, YOSHIKI;OKUMIYA, MASAHIRO
分类号 C23C18/52;C23C24/04;C25D5/08;C25D5/44;C25D15/02;(IPC1-7):C25D5/00;C25D21/12 主分类号 C23C18/52
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