| 摘要 |
<p>For the tape BGA package according to this invention use is made of a transparent base film (9). Such a base film (9) has a device hole (2) to which is inserted a semiconductor chip (4), and a plurality of pads (3) arranged in matrix from and wirings (101) for connecting these plurality of pads (3) to the electrodes of the semiconductor chip (4) are formed on the base film (9). Further, a transparent cover resist (7) is applied to the entire surface of the base film (9) except for the top portions of the plurality of pads (3), and spherical bumps (11) are formed respectively on the plurality of pads (3). With this arrangement, it is possible to inspect by visual observation the bonding conditions between the bumps (11) and the outer lead bonding pads (12) on a printed circuit board (13) even after the package is mounted on the printed circuit board (13). <IMAGE> <IMAGE></p> |
