| 摘要 |
A method for stopping a polish planarization wherein an etch-stop layer (13, 21, 31) is formed. The etch-stop layer (13, 21, 31) may be formed on a substrate (11) or on a conductive layer (12). The etch-stop layer (13, 21, 31) includes a metal and a grit material (17, 25, 35) such as a diamond powder. The etch-stop layer (13, 21, 31) serves as a stop to a mechanical polishing apparatus. The mechanical polishing apparatus removes a planarization layer (14, 22, 33) by polishing, but is unable to remove the etch-stop layer (13, 21, 31) because the etch-stop layer is able to withstand a polishing action of the mechanical polishing apparatus. The etch-stop layer (13, 21, 31) provides protection for the metal from mechanical damage during polish planarization and allows formation of a planar surface.
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