| 摘要 |
PURPOSE: To realize accurate motion of a tool with respect to a chip or a lead at the time of wire bonding by avoiding deviation from parallelism between the driving focus of the tool in a wire bonder and the image pickup axis of an image pickup means. CONSTITUTION: A camera tool distance is set while sectioning into a chip side camera tool distance and a lead side camera tool distance. Both camera tool distances are determined by performing an operation for putting a mark on the upper surfaces of a semiconductor chip 3 and a lead 2a along the driving locus of a tool, and a operation for shifting the image pickup means 4 toward a target position, i.e., the mark. |
