发明名称 SURFACE MOUNTING TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE: To prevent peeling off of each of a plurality of outer leads that are arranged on one side of a packaged body after the leads are mounted on the mounting surface of a substrate. CONSTITUTION: The title device is provided with a plurality of outer leads 3B whose connection part 3B1 is fixed on the surface of a connecting terminal 9 arranged on the mounting surface 8A of a mounting substrate 8 by using a soldering material 10, on one side of a packaged body 5. In such a device, each of the leads 3B is formed of metallic film prepared on the surface of a flexible film 2, and the parts 3B1 of the leads 3B are respectively supported to the mounting face 5C of the body 5 facing the surface 8A of the substrate 8 by using the film 2.
申请公布号 JPH08111494(A) 申请公布日期 1996.04.30
申请号 JP19940245474 申请日期 1994.10.11
申请人 HITACHI LTD;HITACHI TOBU SEMICONDUCTOR LTD 发明人 TSUCHIYA JUNICHI;NAGAMINE TORU;SAITO MASAHIRO;SATO HITOHISA;SATO YUKIHIRO;AOKI SUMIYO;HOSHI AKIRO
分类号 H01L23/04;H01L23/50 主分类号 H01L23/04
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