Verfahren zum Montieren von Halbleiterelementen

摘要

A method of mounting a plurality of semiconductor elements (2) each having bump electrodes (4) on a wiring board (5) by pressing the semiconductor elements to the wiring board while aligning the electrodes and heating the structure. In the mounting method, one or more heat sinks (1) are previously joined to the backs opposite to the surfaces with the bump electrodes formed thereon of the semiconductor elements.