Verfahren zum Formen von elektrischen Verbindungen in laminierten Kontaktlöchern

摘要

A method for forming electrical interconnections in vias is provided by laser drilling vias in a composite that contains at least two circuitized organic polymeric substrates superimposed upon each other. The laser drilling causes metallic circuit lines (5,6) contained within each substrate to melt and form a fused mass (9) protruding a short distance out of the side of the drilled vias. Next, the drilled vias are plated with a conductive metal to thereby provide the interconnections.