| 摘要 |
<p>PURPOSE: To carry out the thermal transfer printing in a good manner just at the cost of paper by bonding a card base composed of a low heat deformation temperature material with the surface of another card base with a built-in electronic circuit composed of a high heat deformation temperature material or applying a material for the second card base on the surface of the first card base for coating. CONSTITUTION: A second card base 5 composed of a low heat deformation temperature, for instance, polyvinyl composed of hard ABS resin having the heat deformation temperature of 55 deg.C-75 deg.C is applied for coating on the surface of a first card base 3 with a built-in electronic circuit 4 composed of a high heat deformation temperature material of large rigidity, for instance, polyphenylene sulfide having the heat deformation temperature of 260 deg.C or over. Or, a material for the second card base 5 is applied on the surface of the first card base 3. An ID card 7 can be manufactured by the arrangement. The electronic circuit 4 is constituted of a pattern connecting electrically an area between chips of IC or an integrated circuit and elements by soldering or the like.</p> |
