发明名称 Sputtering target and method of manufacturing the same
摘要 According to the present invention, silicide grains are coupled with each other in a linked manner so as to provide a metal silicide phase, and grains forming a Si phase are dispersed in the gaps of the metal silicide phase discontinuously so as to provide a mixed structure of a sputtering target of high density and containing carbon at a rate less than 100 ppm. Because of the high density and high strength of the target, generation of particles at the time of sputtering can be reduced, and because of the reduced content of carbon, mixing of carbon in a thin film formed by the sputtering can be prevented.
申请公布号 US5508000(A) 申请公布日期 1996.04.16
申请号 US19940345405 申请日期 1994.11.21
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 SATOU, MICHIO;YAMANOBE, TAKASI;KAWAI, MITUO;KOMATU, TOORU;SHIZU, HIROMI;YAGI, NORIAKI
分类号 C04B35/58;C23C14/34;(IPC1-7):B22F1/00 主分类号 C04B35/58
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