发明名称 Porous silicon trench and capacitor structures
摘要 The invention provides a capacitor structure utilizing porous silicon as a first plate of the capacitor structure, thereby greatly increasing the surface area available for the capacitor and thereby the capacitance attainable. The invention also provides a trench structure having a porous silicon region surrounding the sidewalks thereof. Such a trench can then be utilized to totem a capacitor according to the subject invention. Methods of producing the capacitor and trench structures according to the subject invention are also provided. Porous silicon is produced utilizing electrolytic anodic etching.
申请公布号 US5508542(A) 申请公布日期 1996.04.16
申请号 US19940330652 申请日期 1994.10.28
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 GEISS, PETER J.;KENNEY, DONALD M.
分类号 H01L27/04;H01L21/02;H01L21/334;H01L21/822;H01L21/8242;H01L27/108;H01L29/94;(IPC1-7):H01L27/108;H01L29/76 主分类号 H01L27/04
代理机构 代理人
主权项
地址