| 摘要 |
PURPOSE: To improve the reliability and quality of the mounting state of surface mounting parts even when parts having different terminal pitches are mounted in a mixed state. CONSTITUTION: At the time of mounting a plurality of surface-mounting chip parts 3a and 3b having different terminal pitches on a printed board 1, the printing thickness of solder is controlled to an appropriate value and the numbers of solder opens, solder bridges, etc., are reduced by dividing the parts 3a and 3b into groups based on the size ranges of their terminal pitches and respectively mounting the groups on different surfaces of the board 1 in such a way the group of parts 3a is mounted on the front surface 1a of the board 1 and the group of parts 3b is mounted on the rear surface 1b of the board 1. In addition, other chip parts 4a and 4b are also mounted on a sub-printed board 2 provided to increase the mounting surface by dividing the parts 4a and 4b into groups in the same way. |
