| 摘要 |
PURPOSE: To prevent the occurrence of voids by uniforming the flow of a sealing resin for sealing the gap between a circuit board and a flip chip by mounting the flip chip on the circuit. CONSTITUTION: Grooves 4 passing between connecting terminals 2 are formed by selectively etching a protective film 3 formed at an element mounting portion on a glass epoxy substrate 1, thereby providing a smooth flow of sealing resin 7 by mounting a semiconductor chip 6 and preventing the occurrence of voids and enhancing the reliability.
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