发明名称 MANUFACTURE OF CERAMIC MATERIAL MOLDED BODY FOR ELECTRONIC PART
摘要 PURPOSE: To protect a ceramic material molded body formed in a preceding process against damage in handling when a ceramic burned molded body such as a core used for a coil part or the like is obtained. CONSTITUTION: A ceramic material molded body is molded out of a mixture of ceramic material powder and binder where thermosetting resin is added and cured at the same time or after a molding process. By this setup, a cured body of thermosetting resin has a three-dimensionally reticulated structure, so that the ceramic material molded body is enhanced in mechanical strength and capable of being protected against damage, and a product equipped with the ceramic material molded body is enhanced in yield and reliability.
申请公布号 JPH0897028(A) 申请公布日期 1996.04.12
申请号 JP19940258973 申请日期 1994.09.29
申请人 TAIYO YUDEN CO LTD 发明人 HARASAWA TAKAYA;KASHIWA TOMOO
分类号 H01F1/34;H01F1/37 主分类号 H01F1/34
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