| 摘要 |
PURPOSE: To provide a dip device for improving the yield of electronic parts by preventing stringer and snapback and a method for forming an external electrode. CONSTITUTION: A carrier plate 21 is lowered by an elevation device 24 and electronic parts ground is dipped into a conductor paste 3 and then the dipped electronic parts ground 1 is raised. During raising, vibration is propagated to the electronic parts ground 1 by a vibration device 22. The vibration rapidly separates conductor paste 3 between the electronic parts ground 1 and the dip table 2, thus preventing the conductor paste 3 from causing stringer or snapback. |
