发明名称 |
Abdeckstreifen zum Verpacken von chipartigen, elektronischen Bauteilen |
摘要 |
A cover tape (1) for packaging of chip type electronic parts, which tape comprises an outer layer (2), an intermediate layer (4) and an adhesion layer (5) and which is heat-sealable to a plastic carrier tape having at given intervals pockets for accommodation of chip type electronic parts, the outer layer being a biaxially oriented film (2), the intermediate layer (4) being a polyolefin film which causes its own cohesive failure to enable peeling, and the adhesion layer (5) being a dispersion of conductive fine powders of tin oxide or the like in a thermoplastic resin. In the cover tape (1), the adhesion layer (5) is rendered antistatic by the conductive fine powders. |
申请公布号 |
DE69117730(D1) |
申请公布日期 |
1996.04.11 |
申请号 |
DE1991617730 |
申请日期 |
1991.10.29 |
申请人 |
SUMITOMO BAKELITE CO. LTD., TOKIO/TOKYO, JP |
发明人 |
MIYAMOTO, TOMOHARU, SUMITOMO BAKELITE ITAMISO302, ITAMI-SHI, JP;MAEDA, SHIGERU, KOBE-SHI, JP |
分类号 |
C09J7/02;H05K13/00;(IPC1-7):C09J7/02 |
主分类号 |
C09J7/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|