HARMFUL MATERIAL REMOVING AGENT, REMOVING METHOD AND REMOVING DEVICE

摘要

PURPOSE: To provide a harmful material removing agent, removing method and removing device which are capable of rapidly and efficiently removing harmful materials with a small amt. of use and feature high mechanical strength. CONSTITUTION: This harmful material removing agent is formed by dispersing (b) a semiconductor having a forbidden band width of 0.5 to 5eV and (c) a reinforcing material selected from a group consisting of fibrous materials and granular materials into (a) the hydrated flocs of a hydraulic compd. The harmful material removing agent is otherwise obtd. by coating a network structural body with a slurry contg. (a') hydraulic compd. and (b) the semiconductor having the forbidden band width of 0.5 to 5eV and solidifying the hydraulic compd. The method for removing the harmful materials is executed by bringing gas contg. the harmful materials into contact with the harmful material removing agent described above and irradiating both with light.