| 摘要 |
A combination measuring and ablation laser apparatus is provided which generally includes an ablating laser, a profilometer laser, an automatic feedback control unit and electro-mechanical positioning apparatus. The combination measuring and ablation laser apparatus can have a single multi-mode laser having an ablating mode and a measuring mode and a positioning means for positioning the laser between ablating and measuring modes. In operation, the profilometer laser measures the thickness of a diamond sample and compares it to the desired thickness. Where the measured thickness is too large, the feedback control unit activates the ablating laser for a predetermined time interval to smoothen any irregularities which may be contributing to the diamond sample thickness. At the end of the time interval, the portion is remeasured by the profilometer laser to determine if it conforms to the desired thickness. If the portion still fails to conform to the desired thickness, the feedback control unit repeats the steps of positioning and activating the ablation laser to further ablate the portion. This process is repeated until the thickness of the portion is equal or less than the desired thickness, after which the same procedure is used on the rest of the diamond sample until a uniform desired thickness is achieved throughout.
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