发明名称 |
Cooling system of electronic computer using flexible members in contact with semiconductor devices on boards |
摘要 |
An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members for thermally connecting semiconductor devices whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards onto which the semiconductor devices and the like constructing the electronic computer are mounted and the cooling apparatus such as a refrigerating apparatus and the like are compactly enclosed in a single casing. Or, the circuit boards and the cooling apparatus are compactly enclosed in separate detachable casings, respectively. Thus, a structure in which desired semiconductor devices can be certainly cooled by using the cooling members is obtained.
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申请公布号 |
US5504924(A) |
申请公布日期 |
1996.04.02 |
申请号 |
US19940317621 |
申请日期 |
1994.09.26 |
申请人 |
HITACHI, LTD. |
发明人 |
OHASHI, SHINGEO;NAKAJIMA, TADAKATSU;KUWAHARA, HEIKICHI;HATADA, TOSHIO;MATSUSHIMA, HITOSHI;SATO, MOTOHIRO;INOUYE, HIROSHI;OHBA, TAKAO;YAMAGIWA, AKIRA |
分类号 |
G06F1/00;F28D15/02;G06F1/20;H05K7/20;(IPC1-7):G06F9/00 |
主分类号 |
G06F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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