| 摘要 |
PURPOSE: To be effectively accumulable of opaque coatings on an electronic device, by heating the coated composition under the specified condition to convert it to a ceramic film, after applying a covering composition contg. a silica precursor resin and a filler contg. an insol. salt of heavy metals onto surfaces of integrated circuits. CONSTITUTION: In the case of forming a radiation-impermeable film on integrated circuits, the composition contg. a silica precursor resin and a filler contg. an insol. heavy metal salt are selectively applied at first onto the surfaces of the integrated circuits not so as to cover its bonding pads or streets. And the composition is converted to the radiation-impermeable ceramic film by heating thus covered integrated circuits under a condition at 50-1000 deg.C for 6 hours. In this case, as the filler, a substance selected from carbonate, sulfate and oxide of barium, lead, silver, gold, cadmium, antimony, tin, palladium, strontium, tungsten and bismuth is used. |
