| 摘要 |
PURPOSE: To obtain a mounting method in which a package is held easily in a positioning operation or a mounting operation when an SVP-type (vertical mounting-type) semiconductor is mounted, in which a mounting operation is simplified and in which a high-density mounting operation can be performed. CONSTITUTION: A semiconductor device is provided with leads 12 on the rear surface of packages 11A, 11B, and it is mounted in such a way that the leads 12 are connected to a mounting board 1 so as to be directed in the vertical state. In the semiconductor device, one side face of the package which is set to be vertical in a mounted state is provided with female protrusions 14 and a side face on the opposite side of the side face is provided with male protrusions 15 which can be fitted to the female protrusions 14, and the packages in a plurality are mounted on the mounting board 1 in a state that they are arranged. At this time, the female protrusions 14 on the package 11A on one side are fitted to the male protrusions 15 on the adjacent package 11B so as to integrate both packages. Thereby, it is not required to hold and position the respective packaged individually, and their mounting operation can be simplied. |
