发明名称 |
Method for electrically and mechanically connecting at least two conductive layers |
摘要 |
A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
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申请公布号 |
US5502889(A) |
申请公布日期 |
1996.04.02 |
申请号 |
US19930001811 |
申请日期 |
1993.01.08 |
申请人 |
SHELDAHL, INC. |
发明人 |
CASSON, KEITH L.;MYERS, CAROL;GILLEO, KENNETH B.;SUILMANN, DEANNA;MAHAGNOUL, EDWARD;TIBESAR, MARION |
分类号 |
H05K3/28;H05K3/32;H05K3/36;H05K3/46;(IPC1-7):H05K3/36 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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