| 摘要 |
PURPOSE: To obtain an IC package structure on which a multisize IC chip 4 can be mounted on a common IC package 1 using a wire path which is always appropriate. CONSTITUTION: In the title IC package structure in which outer leads 2 and the inner leads 3, which are conducted to the outer leads 2, are provided, an IC chip 4 is mounted in a cavity 5 located in the center part and the IC chip 4 and the inner lead 3 are connected by a bonding wire, several kinds of auxiliary rings 10, having the size corresponding to the size of the IC chip 4 to be mounted, are incorporated in a replaceable manner, and a bonding wire is wire-bonded by relaying the auxiliary ring 10. |
