| 摘要 |
PURPOSE: To easily cool a multilayer substrate by providing a plurality of through holes which penetrate an insulation substrate body, a surface conductor, a reverse side conductor, and an inner-layer conductor, providing a conductor in a through hole at the inner periphery, and then connecting the surface conductor, reverse side conductor, and the inner-layer conductor. CONSTITUTION: A surface conductor 4 and a reverse side conductor 5 are formed on the front and rear surfaces of an insulation substrate body 1, respectively. A plurality of through holes 2 are provided in lattice shape so that they pass through the surface conductor 4 and the reverse side conductor 5. An inner-layer power supply plane 6 which is an inner-layer conductor is laminated in the insulation substrate body 1 and is connected to a power supply. A conductor 3 in through hole is provided at the inner periphery of the through hole 2 and the surface conductor 4, the reverse side conductor 5, and the inner-layer power supply plane 6 are connected. Not only heat generated by the inner-layer power supply plane 6 but also heat generated from the surface conductor 4 and the reverse side conductor 5 are transferred to the conductor in the through hole 2 and are cooled by the natural air convection to easily radiate heat. |
