An apparatus and method for selectively removing undesired material from the surface of a substrate provides a flow of inert gas over the undesired material susbtrate surface while irradiating the undesired material with energetic photons. The invention enables removal of undesired material without altering the physical properties of the material underlying or adjacent the removed, undesired material. The invention can be applied to produce changes in surface topography (including nano-structuring and surface planarization).
申请公布号
WO9609128(A1)
申请公布日期
1996.03.28
申请号
WO1995US11993
申请日期
1995.09.15
申请人
CAULDRON LIMITED PARTNERSHIP;ENGELSBERG, AUDREY, C.;FITZPATRICK, DONNA, R.