Connecting electronic component to substrate with several contact faces

摘要

One component surface locates Al contacting faces for contact faces on the substrate via contacting metallising on both faces, consisting mostly of Au. The substrate contact faces contain contact humps, mostly of Au. The component Al contact faces are aligned with the substrate ones. Then, under pressure and temp. effect, the two types of contact faces are firmly coupled. Pref. the substrate contact face humps are so formed that they contain a narrow peak and a wider base. The humps may be formed on the substrate contact faces by a mechanical process, such as ball-bumping, contg. 95 wt. % of Au and 5 % of Td.