| 摘要 |
PURPOSE: To provide a method for producing a super-micro connector of high connectability and reliability, allowing good connection state via the restraint of a connection defect with a semiconductor chip or a circuit board electrode. CONSTITUTION: A plurality of conductors 2 substantially arranged in parallel are fixed with an elastic insulator 3 laid in the gap thereof and a complex structure formed out of the conductors 2 and the insulator 3 is thereby prepared. Then, the structure 4 is cut along a plane F orthogonal with the conductors 2 to prepare a plurality of complex chips 5. Thereafter, the insulator 3 is dissolved and removed from at least one of cutout edges of each chip 5 by use of a chemical, thereby exposing the ends of a plurality of the conductors 2 over the prescribed length. Then, a solder bump 6 is formed on the the end of each exposed conductor 2. |
