MANUFACTURING PROCESS OF SEMICONDUCTOR CONTACT DEVICE

摘要

forming an interlayer insulating film(4) on a first conducting line(30), forming a contact mask(5) after depositing photosensitive film and exposing the first conducting line(30) by forming a contact hole on an interlayer insulation film(4) using a contact mask(5); forming a connection part(45) by etching the exposed first conduction line(30) with constant depth after the first step; a forming a second conducting ling(6) on the connection part(45) and the contact hole of the interlayer insulation film (4) after the second step.