| 摘要 |
The method is used to assemble an electronic package of the type having a plurality of external conductive output pads for subsequent surface mounting of the electronic package. The method includes forming a nonconductive frame within the opening of a conductive lead frame such that the nonconductive frame is attached to and encapsulates a portion of each of the leads of the conductive lead frame. An electronic package, which includes two printed circuit boards, having components and conductive output areas on respective sides thereof, is positioned within the non-conductive frame from opposite sides and the conductive output areas of the boards attached to respective parts of different ones of the leads of the conductive lead frame. The electronic package is then encapsulated, leaving an air gap between the boards which cushions and isolates the internal solder joints from subsequent stress by allowing the boards to flex. The leads of the conductive lead frame are then separated from the frame. |
