PACKAGE FOR SEMICONDUCTOR ELEMENT

摘要

PURPOSE: To obtain a highly reliable package for semiconductor element in which the heat being generated from a semiconductor element contained therein at the time of operation is dissipated well to the outside and the semiconductor element can be operated normally and stably at a low temperature for a long term. CONSTITUTION: In the package for semiconductor element a heat plate 9 is brazed to the surface of an insulating case 4 for containing a semiconductor element 3 wherein a groove G is made in the brazing face of the heat plate 9.