SEMICONDUCTOR WAFER, DICING METHOD THEREFOR AND SEMICONDUCTOR DEVICE

摘要

PURPOSE: To enhance the reliability of a semiconductor device built in an SCP by increasing the degree of freedom in the dicing dimension of a chip. CONSTITUTION: In a wafer 30, a data region 35 on which a required circuit is formed along with wire bonding pads 36 for external connection thereof is provided in the center of a larger number of chip regions 34 sectioned by section lines 32, 33. Interconnection pad groups 38 facing the wire bonding pads and arranged with interconnection pads 39 for external connection are formed on the outside in the data region 35. The wafer 30 is diced without traversing the data region 35 or the interconnection pad group 38 and a diced chip is packaged to produce a semiconductor device.