A saw blade segment with silver solder is disclosed. The silver solder of the segment facilitates substitution of the segments for abraded segments of the saw blade, thus to allow users to easily directly substitute the new segments for the abraded segments of the blade without sending the abraded saw blade to a reproduction factory and to let the users save time and cost in reproduction and reuse of the abraded saw blade. The segment also removes the typical silver solder injection device from the saw blade production factory, thus to improve the productivity of the saw blades and let the saw blade production process be automated.
