发明名称 Method for the deposition of diamond film on the electroless-plated nickel layer
摘要 PCT No. PCT/KR94/00115 Sec. 371 Date Feb. 21, 1997 Sec. 102(e) Date Feb. 21, 1997 PCT Filed Aug. 24, 1994 PCT Pub. No. WO96/06206 PCT Pub. Date Feb. 29, 1996A method for the deposition of a diamond film, which includes the steps of immersing metallic or nonmetallic substrate in and electroless nickel plating bath containing a reducing agent to form a nickel layer; and depositing the diamond film on the electroless nickel plated substrate. As a result, employing electroless plating to form an inter layer is improved. In addition, the diamond film can be formed regardless of the type of materials used.
申请公布号 AU7468294(A) 申请公布日期 1996.03.14
申请号 AU19940074682 申请日期 1994.08.24
申请人 NATIONAL INDUSTRIAL TECHNOLOGY INSTITUTE 发明人 JUNG-IL PARK;KWANG-JA PARK
分类号 C30B29/04;B24D3/10;C23C16/26;C23C16/27;C23C16/511;C23C28/00;(IPC1-7):C23C28/00;B24D3/34;B24D3/00 主分类号 C30B29/04
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