| 摘要 |
PROBLEM TO BE SOLVED: To obtain a compact inductor structure of high performance and reasonable cost by fixing a substrate to a module or an assembly and combining it with an inductive element dielectrically. SOLUTION: An inductor structure has a dielectric high resistance semiconductor or a ferrite chip 1, and a chip 1 is mounted on a section of an MCM-D substrate inductor 2 by a flip-chip solder bonding. A metallic coating layer 3 is formed in an upper surface of the chip 1, and the layer 3 is locally removed and/or patterned using a laser beam. A pattern structure is of a concentric square or circular ring pattern and is of spiral structure. A line of solder bump structures 4 is formed on one main surface of a wafer, and a base of the chip 1 is formed. The solder bumps 4 become mechanical positioning and supports and physically separate the diced and combined chip 1 from an MCM-D substrate surface. |
