发明名称 MANUFACTURE OF PLATED RESIN HOLLOW MOLDED PRODUCT
摘要 PURPOSE: To manufacture a plated resin hollow molded product in which no cracks are formed on a resin layer and a plated layer. CONSTITUTION: A hollow handle member 8 having the minimum wall thickness of 2mm or more of a couple of metal brackets 6a and 6b of ABS resin molded integrally is blow molded, and chemical plating and electrical plating are applied successively on the surface of the component to form a copper plated layer having the minimum film thickness of 30μm or more as a primary coat. A through-hole running through a hollow section is formed preliminarily on the wall surface of the hollow handle member 8 prior to the chemical plating and electrical plating, and one metal bracket 6a is retained on a hanging member 9a of a conveyor 9 and immersed in metallic salt water solution to which direct current is applied from an anode in a plating tank 10, and electrolytic reduction is carried out using one bracket 6a as a cathode in the state of filling the metallic salt water solution in the hollow section through the through-hole to form the copper plated layer.
申请公布号 JPH0866970(A) 申请公布日期 1996.03.12
申请号 JP19940228896 申请日期 1994.08.30
申请人 KYORAKU CO LTD 发明人 TAMADA TERUO
分类号 B29C71/00;B29C59/00;B29D22/00;C08J7/06;C25D5/56;C25D7/04;(IPC1-7):B29C71/00 主分类号 B29C71/00
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