| 摘要 |
PURPOSE: To provide a method of manufacturing a multilayer printed-wiring board, which has a blind through hole, through which various interlayer connections between a plurality of layers are made, and is superior in a degree of freedom of wiring, without increasing a plating process and a press process. CONSTITUTION: A thermosetting resin layer 30 in a semicured state is formed on the side of one surface of a first substrate 11 with conductor circuits 20 formed on at least its one surface, a first through hole 40, which penetrates the substrate 11 and the layer 30, is formed and the substrate 11 is laminated on the side of one surface of a second substrate 12 with conductor circuits 20 formed on at least the one surface via the layer 30 to form a multilayer board 10 having the layer 30, which is provided with a plurality of the conductor circuits 20 therein, in the interior. Moreover, a second through hole 50, which penetrates the surface and rear of the board 10, is formed and platings 60 are simultaneously applied in the holes 40 and 50. |
