| 摘要 |
PURPOSE: To automatically inspect a wafer, a X-ray mask, a substrate, etc., at a manufacturing site by providing an electronic beam generator to generate electronic beam. CONSTITUTION: An inspecting system 10 has two types of operation modes, a die-to-die comparison mode and a die-to-database comparison mode. In both modes, defectives are detected by comparing the image of electronic beam obtained by scanning a substrate 57 with a reference. The substrate 57 to be inspected is automatically placed on a X-Y stage 24 under an electronic beam generator 20 by a substrate handler 34. The electronic beam generator 20, an alignment optical system, an analog deflection circuit 30, a detector 32 are used to inject electronic beam to the substrate 57 and detect secondary electrons, backward scattering electrons and transmitted electrons. For such detecting operation and data collection, an electronic beam generator control computer 42, a video frame buffer 44, an image collecting preprocessor 48 are used. |
