| 摘要 |
<p>PURPOSE: To cool respective semiconductor components according to their heating values and obtaining optimum operation temperature, to improve the calculation throughput and to save the electric power by supplying cooling liquid to the heat-generating semiconductor components independently and controlling their flow rates. CONSTITUTION: To supply cooling air to the heat-generating semiconductor components 2a-2c mounted on a substrate, ducts 4 are provided corresponding to plural substrates. The cooling air supplied by a cooling fan 3a is jetted from holes bored in the ducts 4 to cool the heat-generating semiconductor components 2a and 2c by jetting. Plural cooling fans 3a are fitted so as to send the air by the substrates on which the heat-generating semiconductor components 2a and 2c are mounted individually. Similarly, plural cooling fans 3b are fitted so as to cool the heat-generating semiconductor components 2b. Then heat sensing diodes provided to the heat-generating semiconductor components 2a-2c detect temperature and the rotating speeds of the cooling fans 3a and 3b are controlled according to the detected temperature to vary the cooling capability.</p> |
