MANUFACTURE OF BOARD FOR CHIP LED MOUNTING

摘要

PURPOSE: To obtain a manufacturing method of a board for mounting a chip LED(light emitting diode) of high reliability. CONSTITUTION: In a manufacturing method of a board for mounting chips which has many recessed parts for mounting semiconductor chips on one side surface and through holes or slits for continuity of the front and the back at least on both sides of the recessed parts, the recessed parts are formed by using a drill having a shape wherein a tip cutting blade whose diameter is 0.3-0.9 mm is installed perpendicularly to the shaft, and a protrusion is formed at the center or a part of the end portion of the blade, as a drill for forming the recessed parts.