发明名称 PRINTED WIRING BOARD AND PACKAGING STRUCTURE
摘要 <p>PURPOSE: To prevent the generation of a solder bridge which is easily generated, when a component of a terminal of narrow pitch is soldered. CONSTITUTION: An excess solder absorption region 24 which is not provided with a solder resist 20 is provided to a tip side of a terminal 14, rather than to an end part 22A of a solder pad 22 in the solder resist 20. If much solder paste is attached on the solder pad 22 when the terminal 14 is soldered, excess solder 28 which is fused by the heat of a heating heater travels through a terminal 14 and flows to the tip direction of the terminal 14, inside an excess solder- absorbing region 24. Since the excess solder 28 does not go over the solder resist 20 between the terminals 14, a solder bridge is not formed.</p>
申请公布号 JPH0864939(A) 申请公布日期 1996.03.08
申请号 JP19940182395 申请日期 1994.08.03
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 NAKANISHI TORU;OKUMA HIDEO
分类号 B23K1/14;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/14
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