RESIN-SEALED SEMICONDUCTOR DEVICE

摘要

PURPOSE: To provide a semiconductor device with which a light outside a package is effectively cut off while the small thickness of the package and the mechanical strength of a chip are maintained. CONSTITUTION: A semiconductor chip 2 of a semiconductor memory device, for instance a static random access memory (SRAM), is mounted on a semiconductor device 1. The electrode pads of the semiconductor chip are electrically connected to inner leads 8 with wires 6. For instance gold wires are used as the wires 6. In order to meet the requirements of TSOP which is a thin package, the wires are formed into low loop forms. On the top surface of the package 4 of the semiconductor device 1, a light shielding layer 5 is formed by coating. For instance paint containing carbon is applied to form the light shielding layer 5.