发明名称 Apparatus and method for laying a wire
摘要 To provide wire laying method and apparatus which realize high utilization of a wire laying space by pressing a plurality of wires one over another in a wire groove formed in an insulating plate, wires 2A to 2C drawn from a wire laying head 5 are, while being inserted into a wire groove 1a using a natural bend R, forcibly pressed to specified depths by a pressing pin 11 in synchronism with the movement of the wire laying head 5. <MATH>
申请公布号 EP0699564(A1) 申请公布日期 1996.03.06
申请号 EP19950111863 申请日期 1995.07.27
申请人 SUMITOMO WIRING SYSTEMS, LTD. 发明人 YAMADA, TAKAYUKI, C/O SUMITOMO WIRING SYSTEMS, LTD;ROKUTANI, HIROSHI, C/O SUMITOMO WIRING SYSTEMS LTD;INOUE, NORI, C/O SUMITOMO WIRING SYSTEMS, LTD.
分类号 B25B27/14;B60R16/02;H02G3/16;H05K7/06 主分类号 B25B27/14
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