| 摘要 |
The invention is a printed wire board laminate comprising resin layers reinforced with parallel, unidirectional fibres, the laminate having a thickness factor of below 5,5. The thickness factor is the ratio of the thickness of the substrate in mu m and the average titer (linear density) of the yarn used (in tex). The laminates can be made using a method in which a high extent of filament spreading can be retained by virtue of at least partial curing of the UD-reinforced layers. |
