| 摘要 |
A microwave IC comprises a semiconductor substrate (7a) having a semiconductor device (11) at the front surface, a frame (10), and a lid (15) disposed on the frame (10) to hermetically seal the semiconductor device (11). The IC chip may be encapsulated in a resin, and the lid (15) prevents the resin from contacting the semiconductor device (11), so that the performance of the semiconductor device (11) is not degraded. In another arrangement, the lid and frame are integral and the lid is bent into the closed position. A plurality of IC's may be fabricated on a substrate, a lid wafer is bonded onto frame members and the structure is subdivided. <IMAGE> |
