Moulding process for integrated circuit packages and moulds

摘要

The present invention provides for a moulding process for integrated circuit packages comprising the following steps: providing for a connection grid (1); providing for a mould in two parts (6) which come into abutment along joining planes (8) on either side of the grid (1) and which define a moulding cavity (7); connecting a chip to the connection terminals (2) of the grid; placing this whole in the mould; and injecting a protective and insulating product; the connection terminals (2) of the grid (1) being independent of one another and a flexible sealing material (10) being arranged right around the moulding cavity (7) in the vicinity of the joining planes (8).